SK Hynix has developed a mobile storage device, the UFS 4.1 solution product, using the world’s highest-layer 321-layer 1Tb Triple Level Cell 4D NAND flash. The product has improved power efficiency by 7% and reduced thickness from 1mm to 0.85mm compared to its previous generation product. The company plans to provide the product to clients for certification within this year and start mass production in the first quarter of next year.
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Auto-posted at: 2025-05-22 21:07:35